8 Superconductive composite heat pipes utilise groove and powder wick structure with dual variable heat pipe thickness for maximum efficiency of heat transfer.

Redesigned dual tower maximises performance and surface area with optimised fin density and thickness.

Optimised lay out consisting of 8 heat pipes to ensure the heat is transferred to all fin area for efficient dissipation.

Expanded surface area of nickel plated copper base provides seamless contact and complete coverage to target all heat zones. Base layer thickness minimised for faster heat conductivity as well as lower cooler height for improved case compatibility.

Equipped with dual variable Mobius fans for exceptional silence without compromising performance.

Staggered 120mm and 135mm Mobius fans create ultimate Push-Pull setup for perfect airflow and air pressure to maximise heat dissipation.

120mm Mobius fan provides 42mm of RAM clearance to fit a wider range of builds without sacrificing performance.

Stealth Series aluminium top cover and all black hardware provides a premium and clean design.